In a prior study utilizing two materials for which thermal and mechanical p
roperties of both materials in bimaterial specimens were matched except for
modulus, it was found that modulus mismatch had a negligible effect on the
stress intensity factor (SIF) level and distribution for cracks in bond li
nes of stress frozen photoelastic bimaterial specimens. However, bond line
residual stresses increased the SIF values. Since it is almost impossible t
o obtain commercial stress freezing materials with matching critical temper
atures (T-c) with different moduli, the present study of cracks parallel to
and within bond lines utilized such materials with T-c mismatch and compar
ed results with parallel studies with matched T-c values in order to evalua
te T-c mismatch effects. Results show that T-c mismatch creates mixed mode
conditions in cracks parallel to the bond line with significant increases i
n the mode I SIF (K-1) for cracks very near the bond line but shows little
effect for cracks within or away from the bond line. The absence of a modul
us mismatch effect is again confirmed as well. (C) 1998 Elsevier Science Lt
d. All rights reserved.