ELECTROMIGRATION - A TYPICAL CORROSION PH ENOMENON IN MICROELECTRONICS

Citation
Kg. Schmittthomas et al., ELECTROMIGRATION - A TYPICAL CORROSION PH ENOMENON IN MICROELECTRONICS, Werkstoffe und Korrosion, 46(6), 1995, pp. 366-369
Citations number
17
Categorie Soggetti
Metallurgy & Metallurigical Engineering","Material Science
Journal title
ISSN journal
00432822
Volume
46
Issue
6
Year of publication
1995
Pages
366 - 369
Database
ISI
SICI code
0043-2822(1995)46:6<366:E-ATCP>2.0.ZU;2-M
Abstract
The most frequent failure of electronic components is electrochemical migration. As a consequence of the formation of humid films on contami nated printed circuit boards shea cuts occur. To obtain an enhanced ca pacity the conductor spacings are reduced, promoting the danger of a f all out by short cuts. In this paper the main mechanisms of the electr ochemical migration consisting of different reactions as metal solutio n, metal migration and metal deposition will be described in detail. A lso methods to avoid electrochemical migration will be discussed.