This paper reports the development of low-cost microwave millimeter integra
ted circuits (MMIC) devices. This was achieved through the use of multi-waf
er MOCVD to reduce the starting material cost, and device fabrication with
a tightly controlled process optimized for the epitaxial structure. A 35 GH
z 0.5 W power amplifier MMIC was designed that can be applied in Ka-band wi
reless applications. MOCVD-grown wafers were fabricated using mask sets bas
ed on this design. Completed wafers yielded 5.55 x 3.2 mm MMIC chips with s
aturated output power of over 0.50 W at 34 GHz and 0.46 W at 35 GHz. With a
further design iteration it is believed that one (1) watt output power cou
ld be obtained from the device. During this work it was demonstrated that M
OCVD p-HEMT wafers could be used interchangeably with MBE wafers as startin
g material for MMIC fabrication, (C) 1998 Elsevier Science B.V. All rights
reserved.