Upgrading of urea formaldehyde-bonded reed and wheat straw particleboards using silane coupling agents

Reed and wheat straw particleboards bonded with urea formaldehyde (UF) resi n were manufactured from two different material configurations (i.e., fine and coarse particles). The board densities were in the range of 0.55-0.90g/ cm(3). The effects of particle size and board density on the board properti es were examined. The properties of particleboard produced from fine partic les were better than those made from coarse particles. An increase in board density resulted in a corresponding improvement in the board properties. T he properties of UF bonded reed and wheat straw particleboards were relativ ely lower than those of commercial particleboards. Three silane coupling ag ents were used to improve the bondability between the reed and wheat partic les and UF resin. Results of this study indicate that all the board propert ies were improved by the addition of silane coupling agent. The degree of i mprovement achieved from each coupling agent was different; epoxide silane was found to be more effective for reed straw particleboard, and amino sila ne was better for wheat straw particleboard.