Gp. Han et al., Upgrading of urea formaldehyde-bonded reed and wheat straw particleboards using silane coupling agents, J WOOD SCI, 44(4), 1998, pp. 282-286
Reed and wheat straw particleboards bonded with urea formaldehyde (UF) resi
n were manufactured from two different material configurations (i.e., fine
and coarse particles). The board densities were in the range of 0.55-0.90g/
cm(3). The effects of particle size and board density on the board properti
es were examined. The properties of particleboard produced from fine partic
les were better than those made from coarse particles. An increase in board
density resulted in a corresponding improvement in the board properties. T
he properties of UF bonded reed and wheat straw particleboards were relativ
ely lower than those of commercial particleboards. Three silane coupling ag
ents were used to improve the bondability between the reed and wheat partic
les and UF resin. Results of this study indicate that all the board propert
ies were improved by the addition of silane coupling agent. The degree of i
mprovement achieved from each coupling agent was different; epoxide silane
was found to be more effective for reed straw particleboard, and amino sila
ne was better for wheat straw particleboard.