Al recoil implantation have been shown to be a possible alternative to dire
ct Al ion implantation to avoid usual problems linked with Al sources. Poor
efficiency of the recoil + annealing process is observed if no barrier or
an oxyde screen layers are used. This problem can be solved using a Si3N4 s
creen layer. Then, P-N and N+/P/N structures can be obtained with deep low
doped P-well with reduced thermal budget. (C) 1999 Elsevier Science B.V. Al
l rights reserved.