Microscopic cavities are known to be efficient gettering sites for metallic
impurities in silicon. In the present study, they were formed in [111] sil
icon by 40 keV room temperature He+ implantation at doses of 5x10(16) and 1
0(17)/cm(2), followed by a heat treatment in an N-2 atmosphere using either
rapid thermal annealing or conventional furnace annealing. Helium desorpti
on and cavity evolution were studied by non-Rutherford elastic scattering o
f protons and Rutherford backscattering/channeling analysis. Cavities and r
esidual defects were observed by transmission electron microscopy (TEM), Th
e retained fraction of helium was shown to depend on the manner of annealin
g and was found to decrease with annealing time much more slowly than the f
irst order gas release model. TEM observations show that {311} defects and
dislocations are also present close to the cavities. Channeling analysis sh
ows that {311} defects dissolve during the first minutes of annealing at 80
0 degrees C. It is assumed that the self-interstitials released from these
defects are able to fill the smallest cavities, thus causing a rapid increa
se of the mean cavity radius. This variation, introduced in the desorption
law, leads to reasonable agreement with the experimental results. For longe
r annealing time the total cavity surface decreases slowly with annealing d
uration. (C) 1999 Elsevier Science B.V. All rights reserved.