Cobalt disilicide microstructures were formed by 70 keV Co2+ focused ion be
am implantation into Si(111) at substrate temperatures of about 400 degrees
C and a subsequent two step annealing (600 degrees C, 60 min and 1000 degr
ees C, 30 min in N-2). It was found that the CoSi2 layer quality strongly d
epends on the pixel dwell time and the implantation temperature. Only for p
roperly chosen parameters continuous CoSi2 layers could be obtained. Scanni
ng electron microscopy and Rutherford backscattering/channelling investigat
ions were carried out combined with a special preparation technique for str
uctures which are smaller than the analysing beam. The quality of the CoSi2
layers which is correlated to the damage was investigated as a function of
dwell-time (1-250 mu s) and target temperature (355-415 degrees C). The re
sults show that the irradiation damage increases with the dwell-time. The S
i top layer was amorphized for longer dwell-times although the substrate te
mperature was always above the critical temperature for amorphization of ab
out 270 degrees C according to the model of Morehead and Crowder. For the h
igh current density of a focused ion beam (1-10 A/cm(2)) the damage creatio
n rate is higher than the rate of dynamic annealing. (C) 1999 Elsevier Scie
nce B.V. All rights reserved.