HIGH-FREQUENCY CIRCUIT COMPONENTS ON MICROMACHINED VARIABLE THICKNESSSUBSTRATES

Authors
DRAYTON RF HENDERSON RM KATEHI LPB
Citation
Rf. Drayton et al., HIGH-FREQUENCY CIRCUIT COMPONENTS ON MICROMACHINED VARIABLE THICKNESSSUBSTRATES, Electronics Letters, 33(4), 1997, pp. 303-304
Citations number
4
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
Electronics Letters → ACNP
ISSN journal
00135194
Volume
33
Issue
4
Year of publication
1997
Pages
303 - 304
Database
ISI
SICI code
0013-5194(1997)33:4<303:HCCOMV>2.0.ZU;2-9
Abstract
The use of Si micromachining techniques to enhance high frequency plan ar circuit design flexibility by offering a method for varying the sub strate thickness in selective locations on the wafer is presented.