Fundamentals of plasma and sputtering processes

Citation
A. Kinbara et al., Fundamentals of plasma and sputtering processes, VACUUM, 51(4), 1998, pp. 475-478
Citations number
10
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
VACUUM
ISSN journal
0042207X → ACNP
Volume
51
Issue
4
Year of publication
1998
Pages
475 - 478
Database
ISI
SICI code
0042-207X(199812)51:4<475:FOPASP>2.0.ZU;2-2
Abstract
Fundamental studies of plasma and sputtering processes mainly carried out i n the authors' laboratories have been surveyed and discussed in the relatio n to the application to sputter deposited thin films. Experimental results on target, substrate and transportation phenomena have been presented The b ombarding effect by energetic particles on substrates during plasma and spu ttering processes on the interface structures between sputter deposited thi n films and substrates was discussed. (C) 1998 Published by Elsevier Scienc e Ltd. All rights reserved.