Ultra-thin silicon-oxide films by sputter-deposition and their applicationto high-quality poly-Si TFTS

Citation
T. Serikawa et S. Shirai, Ultra-thin silicon-oxide films by sputter-deposition and their applicationto high-quality poly-Si TFTS, VACUUM, 51(4), 1998, pp. 781-783
Citations number
10
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
VACUUM
ISSN journal
0042207X → ACNP
Volume
51
Issue
4
Year of publication
1998
Pages
781 - 783
Database
ISI
SICI code
0042-207X(199812)51:4<781:USFBSA>2.0.ZU;2-P
Abstract
This paper describes ultra - thin high - quality silicon oxide (SiO2) films deposited at low temperature by sputtering from a SiO2 target in an oxygen -argon mixture. SiO2 films up to a thickness of 6.5 nm are successfully for med on polycrystalline silicon (poly-Si) films which have a surface roughne ss of several nanometers. The SiO2 films show electrical properties with a sufficiently high breakdown voltage and low leakage current which are compa rable with the electrical properties of the thermally grown SiO2 film on si ngle-crystalline Si at high temperature. Moreover, both n- and p-channel po lycrystalline silicon thin him transistors (poly-Si TFTs) with ultra-thin s puttered SiO2 films show excellent characteristics. (C) 1998 Elsevier Scien ce Ltd. All rights reserved.