Curing conditions effects on the characteristics of thermosetting adhesives-bonded wood joints - Part 1. Substrate influence on TTT and CHT curing diagrams of wood adhesives (vol 56, pg 339, 1998)

Authors
Lu, X Pizzi, A
Citation
X. Lu et A. Pizzi, Curing conditions effects on the characteristics of thermosetting adhesives-bonded wood joints - Part 1. Substrate influence on TTT and CHT curing diagrams of wood adhesives (vol 56, pg 339, 1998), HOLZ ROH WE, 56(6), 1998, pp. 401-401
Citations number
1
Categorie Soggetti
Material Science & Engineering
Journal title
HOLZ ALS ROH-UND WERKSTOFF
ISSN journal
00183768 → ACNP
Volume
56
Issue
6
Year of publication
1998
Pages
401 - 401
Database
ISI
SICI code
0018-3768(199812)56:6<401:CCEOTC>2.0.ZU;2-W