I. Erdin et al., Simulation of high-speed interconnects in a multilayered medium in the presence of incident field, IEEE MICR T, 46(12), 1998, pp. 2251-2257
Citations number
31
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
Simulation of high-speed circuits and interconnects in the presence of inci
dent electromagnetic interference is becoming an important step in the desi
gn cycle. An accurate and efficient method for the analysis of incident fie
ld coupling to traces in inhomogeneous medium is described. The method is b
ased on the application of the physical optics technique. An interconnect c
ircuit simulation stamp is derived. This stamp provides an easy link to cur
rent simulators and to recently developed model reduction techniques. In ad
dition to accounting for the inhomogeneity of the medium, this method provi
des significant in computational efficiency improvement over conventional a
pproaches.