Some key issues in microelectronic packaging

Military and space electronics are tending toward increased system performa nce, i.e., higher speed, higher circuit density, and higher functionality. Recent reductions in government spending on space and military hardware hav e also made cost reduction a key consideration. As electronics approach phy sical size and performance limits, practical considerations such as wireabi lity, thermal management, electromagnetic compatibility, and system reliabi lity become dominant issues in system design. Resolving such issues require s the use of sophisticated analysis and computational methods.