Yz. Wang et al., Crystallization of a-Si : H on glass for active layers in thin film transistors - Effects of glass coating, J ELCHEM SO, 146(1), 1999, pp. 299-305
One hundred nanometer thick a-Si:H films deposited by plasma-enhanced chemi
cal vapor deposition from hydrogen diluted silane at temperatures in the ra
nge 150-320 degrees C were used as precursor materials for solid-phase crys
tallization (SPC) of polycrystalline silicon (poly-Si) on which n-channel t
hin film transistors (TFTs) were fabricated. Furnace annealing at 600 degre
es C was used in order to study the SPC kinetics as a function of depositio
n temperature and substrate coating. The substrates were either bare or sil
icon nitride coated Coming 7059 glass. The poly-Si films were characterized
by using ultraviolet reflectance spectrophotometry to determine the anneal
ing time fdr crystallization and by using transmission electron microscopy
for grain size measurement and nuclei density analysis. It was found that t
here is a strong relation between grain size and deposition temperature for
films deposited on bare glass substrates. For films deposited on silicon n
itride coated glass substrates this correlation is not as strong; however,
upon full crystallization, a-Si:H deposited on nitride coated glass yielded
grains that were larger than those in a-Si:H deposited on bare glass. The
presence or absence of a SiNx barrier layer between an a-Si precursor film
and substrate glass is observed to greatly affect the SPC process. TFT para
meter measurements, on the other hand, have shown that the SiNx-coating of
glass has a significant impact on TFT performance: transistor leakage curre
nt is observed to be markedly reduced by coating. This is attributed to the
increase in grain size and the decrease in the impurity content of active
poly-Si caused by SiNx-coating of glass. (C) 1999 The Electrochemical Socie
ty. S0013-4651(98)03-094-8. All rights reserved.