Simulations of the current distributions in Si-Ge p-MOSFETs are presen
ted for Si-Ce channel designs that have a triangular or a uniform Ge p
rofile. The distributions of current show why the triangular design is
better than the uniform Ge profile. Contributions to the transconduct
ance in both designs are dominated by the Si-Ge channel in the -0.5 to
-1.5 V gate-voltage range but the contribution to the device performa
nce from the current parallel to the top oxide/Si interface dominates
the response by -2.5 V.