Stress evolution during metalorganic chemical vapor deposition of GaN

Citation
S. Hearne et al., Stress evolution during metalorganic chemical vapor deposition of GaN, APPL PHYS L, 74(3), 1999, pp. 356-358
Citations number
19
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
APPLIED PHYSICS LETTERS
ISSN journal
00036951 → ACNP
Volume
74
Issue
3
Year of publication
1999
Pages
356 - 358
Database
ISI
SICI code
0003-6951(19990118)74:3<356:SEDMCV>2.0.ZU;2-M
Abstract
The evolution of stress in gallium nitride films on sapphire has been measu red in real time during metalorganic chemical vapor deposition. In spite of the 16% compressive lattice mismatch of GaN to sapphire, we find that GaN consistently grows in tension at 1050 degrees C. Furthermore, in situ stres s monitoring indicates that there is no measurable relaxation of the tensil e growth stress during annealing or thermal cycling. (C) 1999 American Inst itute of Physics. [S0003-6951(99)04603-3].