New receptacle optical modules using ferrule-integrated chip carrier with solder-bump-bonded photonic device: Singlemode-fiber-based high-speed PIN PD receivers

A new receptacle optical module is proposed that requires no optical-axis a djustment, In this scheme, coupling a photonic device to a fiber is done ba sically by simple butt-joining, which is accomplished automatically by sold er-bump bonding the device onto a platform with an optical fiber glued to a ceramic ferrule. To achieve this coupling, alumina chip carriers were fabr icated to include a zirconia ferrule (containing a singlemode fiber). The m isalignment between the fiber and the solderable patterns on the chip carri er was below 5 mu m (with a cumulative distribution of 50%). Prototype MU ( IEC standard, IEEE P1355) receptacle receiver modules were demonstrated. By solder-bump-bonding the photodiode (PD) onto the chip carrier, optical cou pling was achieved simultaneously with electrical connection to the chip ca rrier. No optical-asis adjustment was required throughout the entire fabric ation of the module. The module achieved wide bandwidths up to 1 and 5 GHz, respectively, with the PD's with 180- and 50-mu m-diameter active areas in stalled inside.