The mechanical toughness of modified ABS (acrylonitrile-butadiene-styrene)
alloys was evaluated using Izod impact, tensile, and compact tension tests.
The modified ABS alloys contain 20 wt % of styrene-N-phenylmaleimide (SMI)
that is added to enhance the thermal resistance of the ABS. In this study,
the effects of matrix composition, rubber/ matrix adhesion, and rubber par
ticle structure on the alloy toughness were investigated. Results from the
tensile test and Izod impact test ranked the alloys in an order that is dif
ferent from that given by K-Ii (stress intensity factor for crack initiatio
n), measured from compact tension specimens. This is due to the difference
in energy-absorption characteristics for crack initiation and crack growth.
The conclusion is supported by optical micrographs on the deformation zone
size. The microdeformation behavior of the alloys was examined using trans
mission electron microscopy (TEM), which revealed different rubber tougheni
ng mechanisms between Izod and tensile specimens. The former contains numer
ous extensive crazes, while the latter, only a very few short crazes, excep
t in regions within a few micrometers from the fracture surface. The domina
nt matrix deformation mechanism for the tensile specimens is believed to be
shear deformation. Another interesting observation from the study is rubbe
r particle cavitation, commonly observed in tensile specimens and Izod spec
imens with solid rubber particles; it did not occur in the Izod specimens c
ontaining salami-type rubber particles. This is attributed to the salami st
ructure that increased the straining rate for the rubber phase, leading to
ductile-brittle transition of the rubber. The transition to brittle deforma
tion of the rubber phase prevented rubber particle cavitation. The microsco
pic examination indicated that toughening mechanisms by the rubber particle
s can be very different among the mechanical tests, which should be taken i
nto account for the rubber toughening of polymers. (C) 1999 John Wiley & So
ns, Inc.