In this paper a new vertical MOS transistor structure including its fabrica
tion and electrical results will be presented. It overcomes the technologic
al and physical limitations encountered when scaling the classical planar t
ransistor into the deep submicron regime. It solves the technological issue
by defining the channel length through epitaxial growth instead of lithogr
aphy. The physical phenomenon of drain induced barrier lowering (DIBL) is l
argely decreased through the use of a heterojunction between source and dra
in. (C) 1998 Elsevier Science S.A. All rights reserved.