Authors
Citation
Ca. Handwerker, Modelling and simulation for electronic packaging, SOLDER S MT, 10(3), 1998, pp. 5-5
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
SOLDERING & SURFACE MOUNT TECHNOLOGY
ISSN journal
09540911
→ ACNP
Volume
10
Issue
3
Year of publication
1998
Pages
5 - 5
Database
ISI
SICI code
0954-0911(199810)10:3<5:MASFEP>2.0.ZU;2-H