The redistribution of the p-type dopant Be during the post-growth rapid the
rmal annealing in InGaAs layers grown by gas source molecular beam epitaxy
has been studied using secondary ion mass spectrometry technique. The exper
imental structures consisted of a 2000 Angstrom Be-doped (3 x 10(19) cm(-3)
) In0.53Ga0.47As layer sandwiched between 5000 Angstrom undoped In0.53Ga0.4
7As layers. To explain the observed depth profiles, obtained for annealing
cycles with time durations of 10 to 240 s and temperatures in the range of
700-900 degrees C, two models of kick-out mechanism, with neutral and singl
y positively ionized Be interstitial species, have been considered.