Syntheses and properties of organosoluble polyamides and polyimides based on the diamine 3,3-bis[4-(4-aminophenoxy)-3-methylphenyl]phthalide derived from o-cresolphthalein
Cp. Yang et Sy. Tang, Syntheses and properties of organosoluble polyamides and polyimides based on the diamine 3,3-bis[4-(4-aminophenoxy)-3-methylphenyl]phthalide derived from o-cresolphthalein, J POL SC PC, 37(4), 1999, pp. 455-464
Citations number
23
Categorie Soggetti
Organic Chemistry/Polymer Science
Journal title
JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY
Diamine 3,3-bis[4-(4-aminophenoxy)-3-methylphenyl]phthalide (BAMP) was deri
ved from the o-cresolphthalein, and then it was polycondensated with variou
s aromatic dicarboxylic acids and dianhydrides to synthesize polyamides (PA
s) and polyimides (PIs), respectively. PAs have inherent viscosities of 0.7
8-2.24 dL/g. Most of the PAs are readily soluble in a variety of solvents s
uch as DMF, DMAc, and NMP and afforded transparent and tough films from DMA
c solutions. The cast films have tensile strengths of 75-113 MPa as well as
initial moduli of 1.71-2.97 GPa. These PAs have glass transition temperatu
res (T(g)s) in the range of 242-325 degrees C, 10% weight loss temperatures
occur up to 473 degrees C, and char yields are between 57 and 64% at 800 d
egrees C in nitrogen. PIs were first synthesized to form polyamic acids (PA
As) by a two-stage procedure that included a ring-opening reaction, followe
d by thermal or chemical conversion to polyimides. Inherent viscosities of
PAAs are between 0.71 and 1.63 dL/g. Most of the PIs obtained through the c
hemical cyclodehydration procedure are soluble in NMP, o-chlorophenol, m-cr
esol, etc., and they have inherent viscosities of 0.58-1.32 dL/g. T(g)s of
these PIs are in the range of 270-305 degrees C and show 10% weight loss te
mperatures up to 477 degrees C. PIs obtained through the thermal cyclodehyd
ration procedure have tensile strengths of 72-142 MPa, elongations at break
of 8-19%, and initial moduli of 1.80-2.72 GPa. (C) 1999 John Wiley & Sons,
Inc.