Deposition and measurement of sticky particles

A device that measures the deposition characteristics of adhesives within p ulp suspensions is described. The technique entraps stickies onto machine w ires by impact with the wire. The stickies are then tagged with a cationic marker which can then be stained to form dark areas where stickies have dep osited. The wires are not affected by the stain. Image analysis of the wire s and stickies leads to an automated calculation in terms of deposited stic kies per unit area.