Silicon-glass wafer bonding with silicon hydrophilic fusion bonding technology

Silicon-glass wafer bonding is realized with silicon hydrophilic fusion bon ding technology. Tensile strength testing shows that the bonding strength i s large enough for most applications of integrated circuits and transducers . The bonding strengths of 4 in. 575 mu m thick #7740 glass-4 in. 525 mu m thick silicon and of 1.5 in. 1000 mu m thick #7740 glass-2 in. 380 mu m thi ck silicon are larger than 9 MPa both with an annealing temperature of 450 degrees C. (C) 1999 Elsevier Science S.A. All rights reserved.