Removal of surface contaminants by various cryogenic aerosol jets has been
experimentally investigated. Simplified theoretical consideration of their
removal mechanism has been also presented based on the impact power of the
aerosol jets. Under atmospheric operation, water vapor and carbon dioxide c
ould make their particles independent of their concentrations in the carrie
r gas while argon and nitrogen could hardly solidify to their own particles
. The cryogenic aerosol jets were very effective in removing both submicron
particle contaminants and photoresist films on wafers. The rate of the PR
film removal strongly depended on the hardness of the film. Molecular organ
ic films could be also removed with the aerosol jets. In general, the remov
al of the contaminants depends primarily on the physical impact. The remova
l rate increased with the mass concentration of the aerosol particles, rega
rdless of their nature. The rate also increased with the impact velocity of
the jets which was controlled by either the chamber pressure or the distan
ce between the nozzle tip and the contaminant surface. The cryogenic aeroso
l-free jet was much less effective than the corresponding aerosol jets but
had some effectiveness compared to the noncryogenic one. The thermal shock
of the film was, therefore, supposed to have a secondary effect on the cont
aminant removal.