Some preliminary experiments have been performed to determine the effect of
mandrel geometry and plating bath composition on the thickness uniformity
of gold and copper electroformed hohlraums. It was observed that for gold p
lating, the edge radius has a dramatic influence on uniformity in a directi
on opposite that expected (i.e. uniformity worsened with larger radius) and
that extension of the front small-diameter cylinder gave a slight improvem
ent in hohlraum symmetry. In the case of copper plating it was found that,
as expected, reduced metal concentration improved uniformity, however, it w
as also found that the selection of additives has an even more pronounced e
ffect.