True constant temperature measurement system for lifetime tests of metallic interconnections of IC's

The design and principle of operation of a measurement system for performin g reliability tests on metallic interconnections of integrated circuit is p resented. The instrument is controlled by a personal computer which set the test conditions (current and temperature) and acquires the data during the entire duration of the lifetime test, Unlike traditional systems designed for this application, an independently controlled microoven is provided for each sample under test, This solution compensates for the effect of the Jo ule heating of the samples which is not constant during the test and slight ly different from one sample to another. This approach will allow, probably for the first time, such tests to be performed under ideal conditions of c onstant current and temperature for all the samples.