Applying TLP bonding to the joining of structural intermetallic compounds

Transient-liquid-phase bonding provides a method of joining nonweldable mat erials intended for elevated temperature service. This paper discusses the mechanisms of transient-liquid-phase bonding as a reactive liquid process f or the joining of structural intermetallic compounds. The importance of all oying reactions for successful wetting of the substrates by the liquid inte rlayer is stressed, and the roles of dissolution, isothermal solidification , and homogenization processes in microstructural development are discussed .