Solventless deposition of thin, uniform dielectric films is of considerable
interest and importance in the microelectronics industry due to environmen
tal concerns and increasing wafer sizes. This work demonstrates a solvent-f
ree method for atmospheric pressure chemical vapor deposition polymerizatio
n of thin films on a variety of-substrates, including silicon, molybdenum,
platinum and copper. Polymerization of 4-fluorostyrene (4FS) and pentafluor
ostyrene (PFS) is used as a model system. Depth profiling is performed usin
g x-ray photoelectron spectroscopy, ellipsometry, and step profilometry. Fi
lm growth is found to be independent of substrate, and proceeds with activa
tion energies of 14+/-1 and 15+/-1 kcal/mol, respectively, for 4FS and PFS
deposition between 425 and 550 K. Films are shown by gel permeation chromat
ography to consist of low molecular weight polymer and oligimer species (be
tween 3 and similar to 140 repeat units). Atomic farce microscopy analysis
of films grown by this method indicates that the root mean square thickness
variation along the surface is about 2.5%. [S0734-211X(99)01401-8].