Objective: To analyze the site and thickness of encapsulation around ventri
cular endocardial pacing leads and the extent of tricuspid val re adhesion,
from today's perspective, with implications for lead removal and sensor lo
cation.
Material and Methods: Gross cardiac postmortem analysis was performed in II
cases (8 female and 3 male patients; mean age, 78 +/- 7 years). None of th
e patients had died because of pacemaker malfunction. The mean implant time
was 61 +/- 60 months (range, 4 to 184).
Results: The observations ranged from encapsulation only at the tip of the
pacing lead to complete encapsulation along the entire length of the pacing
lead within the right ventricle, Substantial areas of adhesion at the tric
uspid valve apparatus were noted in 7 of the 11 cases (64%). The firmly att
ached leads could be removed only by dissection, and in some cases, removal
was possible only by damaging the associated structures. No specific optim
al site for sensor placement could be identified along the ventricular port
ion of the pacing leads; however, the fibrotic response was relatively less
prominent in the atrial chamber.
Conclusion: Extensive encapsulation is present in most long-term pacemaker
leads, which may complicate tend removal, The site and thickness of encapsu
lation seem to be highly variable, Tricuspid valve adhesion, which is usual
ly underestimated, may be severe. In contrast to earlier reports, our study
demonstrates that the extent of fibrotic encapsulation may not be related
to the duration since lead implantation. Moreover, we noted no ideal encaps
ulation-free site for sensors on the ventricular portion of long-term pacin
g leads.