Formation, thermal evolution and annealing kinetics of self-interstitial cl
usters in ion implanted Si have been investigated. Deep level transient spe
ctroscopy measurements performed on epitaxial and Czochralski Si samples im
planted with Si ions at energies of 145 keV or 1.2 MeV reveal that these cl
usters are formed for fluences above 10(12)/cm(2) and annealing temperature
s higher than 550 degrees C. Interstitial clusters introduce seven well def
ined levels in the Si band gap at E-v+0.33 eV, E-v+0.52 eV, E-c-0.58 eV, E-
c-0.50 eV, E-c-0.37 eV, E-c-0.29 eV and E-c-0.14 eV. Analysis of the anneal
ing kinetics at temperatures in the range 550-700 degrees C reveal that the
clusters undergo Ostwald ripening and anneal out with a characteristic dis
sociation energy of similar to 2.3 eV for a Si fluence of Ix 10(12)/cm(2).
Futhermore, their annealing temperature increases with implantation fluence
. These results indicate that small interstitial clusters act as the source
of interstitial supersaturation that drive transient enhanced dopant diffu
sion in the absence of extended defects. (C) 1999 Published by Elsevier Sci
ence B.V. All rights reserved.