A buried amorphous layer in Si has been investigated by means of metal gett
ering before and after rc crystallization. Metal impurities, especially Cu
atoms. are intentionally introduced and accumulated in damaged regions of S
i, The measured Cu depth distributions have been compared to the correspond
ing strain profiles and the microstructure of the Si lattice, The buried am
orphous layer has been found to act like a diffusion barrier for the Cu ato
ms. Cu gettering takes place at the crystalline side of the amorphous-to-cr
ystalline (a/c) interface, In this region a Si lattice expansion is observe
d. After recrystallization of the amorphous layer Cu gettering occurs as we
ll outside of the former amorphous layer, mainly at the interfaces. The beh
aviour of Cu atoms in Si seems to be: correlated to the supersaturation of
self-interstitials. (C) 1999 Elsevier Science B.V. All rights reserved.