The electrical activation behavior of N- and Al-implantations in bulk V-dop
ed semi-insulating 4H-SiC is similar to that in 4H-SiC epitaxial layers. Th
e As- and Sb-implantations in p-type 6H-SiC epitaxial layers showed out-dif
fusion behavior with room-temperature sheet carrier concentrations of <20%
of the implanted dose. In n-type GaN, compensating levels introduced by the
high-dose implantation damage are thermally stable even at 1150 degrees C
annealing. (C) 1999 Elsevier Science B.V. All rights reserved.