Region-of-interest microtomography for component inspection

authors describe a novel technique for the nondestructive evaluation of mic roelectronic components using Xray microtomography. Existing microtomograph y systems have spatial resolution of order 1 mu m but require X-ray source brilliance that would become unachievable at higher resolutions. The author s describe an imaging method that reduces the number of X-ray photons requi red from the source without degrading the resolution. The feasibility of th e technique is demonstrated through a series of computer simulations. The r esults are verified with real data from synchrotron experiments.