FILM THICKNESS VARIATION IN A CYLINDRICAL MAGNETRON DEPOSITION DEVICE

The 2D thickness distributions of Cu end Al planar thin films prepared by a home-made cylindrical magnetron with rectangular exit window wer e examined. The experimental results were compared with several models of sputtered particle transport. It has been shown that in the azimut hal direction the best agreement with experimental results was achieve d with the free flight model. Due to an uneven target erosion, the agr eement with the model calculations proved to he somewhat less satisfac tory in the axial direction. An overall similarity of thickness distri butions in the case of Al deposition at P-Ar approximate to 0.7 Pa and Cu deposition at P-Ar approximate to 2.25 Pa working gas pressure has been found. However, it has been found that the portion of backscatte red flux was greater in the case of Al than it was for Cu sputtering.