Citation
So. Chwa et Kh. Kim, Adhesion property of copper nitride film to silicon oxide substrate, J MAT SCI L, 17(21), 1998, pp. 1835-1838
Citations number
12
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF MATERIALS SCIENCE LETTERS
ISSN journal
02618028
→ ACNP
Volume
17
Issue
21
Year of publication
1998
Pages
1835 - 1838
Database
ISI
SICI code
0261-8028(19981101)17:21<1835:APOCNF>2.0.ZU;2-M