Fatigue behaviors of a copper tricrystal - Part II - Crystallographic fatigue crack growth in the vicinity of the triple junction

Authors
Jia, WP Li, SX Wang, ZG Li, GY
Citation
Wp. Jia et al., Fatigue behaviors of a copper tricrystal - Part II - Crystallographic fatigue crack growth in the vicinity of the triple junction, J MAT SCI L, 17(12), 1998, pp. 1041-1044
Citations number
6
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF MATERIALS SCIENCE LETTERS
ISSN journal
02618028 → ACNP
Volume
17
Issue
12
Year of publication
1998
Pages
1041 - 1044
Database
ISI
SICI code
0261-8028(19980615)17:12<1041:FBOACT>2.0.ZU;2-E