Peculiarities of the formation of adsorption layers producing a long-term aftereffect on the kinetics of copper electrodeposition from a sulfate bath

The behavior of a copper cathode in a copper-plating sulfate electrolyte wa s studied upon preliminary modification of its surface by immersion in a so lution containing copper sulfate, sulfuric acid, and thiocarbamide. The con ditions of the preliminary one-time formation of an adsorption film that fo r a long time controls the subsequent electrocrystallization are determined . A necessary condition is the presence of oxygen in the modifying solution . The properties of the once formed adsorption layers that steadily change the kinetics of copper deposition are studied, and a probable role of oxyge n in their formation is suggested.