Packaging impact on switching noise in high-speed digital systems

Citation
S. Gong et al., Packaging impact on switching noise in high-speed digital systems, IEE P-CIRC, 145(6), 1998, pp. 446-452
Citations number
14
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEE PROCEEDINGS-CIRCUITS DEVICES AND SYSTEMS
ISSN journal
13502409 → ACNP
Volume
145
Issue
6
Year of publication
1998
Pages
446 - 452
Database
ISI
SICI code
1350-2409(199812)145:6<446:PIOSNI>2.0.ZU;2-D
Abstract
Owing to the ever-increasing clock frequency in digital circuits and system s. simultaneous switching noise (SSN), caused by fast rise/fall pulse edges in combination with parasitic inductance in the power supply distribution network, is becoming a severe problem in many high-speed digital system des igns. It is quantitatively shown that the influence of SSN. which is neglig ible when the rise/fall time is long (> 5ns), becomes a critical factor, li miting system performance in the subnanosecond rise time region. Based on t heoretical analyses and computational simulations in respect to various pac kaging techniques. technical solutions and design guidelines for reducing S SN are summarised.