Assembly and electrical wiring technologies on planar lightwave circuit (PLC) platform providing hybrid integration of optoelectronic devices and integrated circuits (ICs)

Optoelectronic hybrid integration is a promising technology for realizing t he optical components needed in optical transmission, switching, and interc onnection systems that use wavelength division multiplexing (WDM) and time division multiplexing (TDM). We have already developed versatile optical hy brid integrated modules using a silica-based planar lightwave circuit (PLC) platform. However, these modules consist solely of the optoelectronic semi conductor devices such as laser diodes (LDs) and photo diodes (PDs) and mon olithic optoelectronic integrated circuits (OEICs). To carry out high-speed and versatile electric signal processing functions in future network syste ms, it is necessary to install semiconductor electrical integrated circuits (ICs) on a PLC platform. In this paper, we describe novel technologies for high-speed PLC platforms which make it possible to assemble both ICs and o ptoelectronic devices. Using these technologies, we fabricated a two-channe l hybrid integrated optical transmitter module which is hybrid integrated w ith an LD array chip and an LD driver IC. On this PLC platform, we use micr ostrip lines (MSLs) to drive the LD driver IC. We also considered the effec t of heat interference on the LD array chip caused by the LD driver IC when designing the layout of the chip assembly region. The LD array chip and th e LD driver IC were flip-chip bonded with solder bumps of a different mater ial to avoid any deterioration in the coupling efficiency of the LD array c hip. The optical transmitter module we fabricated operated successfully at 9 Gbit/s non-return-zero (NRZ) signal. This approach using a PLC platform f or the hybrid integration of an LD array chip and an LD driver IC will carr y forward the development of high-speed optoelectronic modules with both op tical and electrical signal processing functions.