Analysis of two-layered micro-channel heat sink concept in electronic cooling

In this work, a new concept for a two-layered micro-channel heat sink with counter current flow arrangement for cooling of the electronic components i s proposed. The thermal performance and the temperature distribution for th ese types of micro channels were analyzed and a procedure for optimizing th e geometrical design parameters is presented. While the power supply system of the two-layered design is not significantly more complicated than the o ne-layered design, the streamwise temperature rise on the base surface was found to be substantially reduced compared to that of the one-layered heat sink. At the same time, the pressure drop required for the two-layered heat sink was found to be substantially smaller than that of the one-layered he at sink. The results demonstrate that the two-layered micro-channel heat si nk design is a substantial improvement over the conventional one-layered mi cro-channel heat sink. (C) 1999 Elsevier Science Ltd. All rights reserved.