A cleaning process for flip chip assemblies before encapsulation

Authors
Sarkar, G Chong, YF Collier, PA
Citation
G. Sarkar et al., A cleaning process for flip chip assemblies before encapsulation, J MAT SCI L, 18(1), 1999, pp. 63-65
Citations number
7
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF MATERIALS SCIENCE LETTERS
ISSN journal
02618028 → ACNP
Volume
18
Issue
1
Year of publication
1999
Pages
63 - 65
Database
ISI
SICI code
0261-8028(19990101)18:1<63:ACPFFC>2.0.ZU;2-1