The effect of post-metallization annealing in H-2 at 723 K on the propertie
s of MOS capacitors with thermally grown thin (13-26 nm) Ta2O5 layers was i
nvestigated. It was established that the annealing effect strongly depends
on the properties of the as-grown oxides and in particular on the oxidation
temperature. The oxidation at higher temperatures (823 and 873 K) is benef
icial for improving the electrical, breakdown and insulating properties of
the films after annealing. A dielectric constant of 32 was reached for thes
e layers and the magnitude of leakage current guarantees their application
in 64 Mbit DRAM. The hydrogen annealing, however, additionally generates sl
ow states in the oxide with a density of about 5 x 10(11) cm(-2). (C) 1999
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