The single wafer processing of epitaxial Si films requires that special att
ention be paid to the design of the substrate heater assembly. This documen
t describes the evolution and testing of an in situ heater used to deposit
epitaxial Si films at temperatures as high as 700 degrees C. One problem en
countered was the production of excessive levels of ultraviolet radiation w
hich contributed to the desorption of water vapor from the vacuum chamber w
alls during the in situ cleaning process. A second problem involved the for
mation of a molybdenum containing film that poisoned epitaxial growth. A fi
nal proven in situ heater design is presented which avoids these problems.
(C) 1999 American Institute of Physics. [S0034-6748(99)03903-9].