Special modulator for high frequency, low-voltage plasma immersion ion implantation

Citation
Xb. Tian et al., Special modulator for high frequency, low-voltage plasma immersion ion implantation, REV SCI INS, 70(3), 1999, pp. 1824-1828
Citations number
24
Categorie Soggetti
Spectroscopy /Instrumentation/Analytical Sciences","Instrumentation & Measurement
Journal title
REVIEW OF SCIENTIFIC INSTRUMENTS
ISSN journal
00346748 → ACNP
Volume
70
Issue
3
Year of publication
1999
Pages
1824 - 1828
Database
ISI
SICI code
0034-6748(199903)70:3<1824:SMFHFL>2.0.ZU;2-2
Abstract
Plasma immersion ion implantation is a burgeoning surface modification tech nique and not limited by the line-of-sight restriction plaguing conventiona l beam-line ion implantation. It is therefore an excellent technique to tre at interior surfaces as well as components of a complex shape. To enhance t he implant uniformity and increase the thickness of the modified layer, we are using a high frequency, low-voltage process to achieve high temperature and dose rate to increase the thickness of the modified layer. The low vol tage conditions also lead to a thinner sheath more favorable to conformal i mplantation. In this article, we will describe our special modulator consis ting of a single ended forward converter with a step-up transformer. The mo dulator is designed to operate from 5 to 35 kHz and the output voltage is a djustable to an upper ceiling of 5000 V that is deliberately chosen to be o ur voltage limit for the present experiments. We will also present experime ntal data on SS304 stainless steel materials elucidating the advantages of our modulator and high frequency, low-voltage experimental protocols. (C) 1 999 American Institute of Physics. [S0034-6748(99)00803-5].