In-line cure of SOD low-k films

Authors
Batchelder, T Cai, W Bremmer, J Gray, D
Citation
T. Batchelder et al., In-line cure of SOD low-k films, SOL ST TECH, 42(3), 1999, pp. 29
Citations number
3
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
SOLID STATE TECHNOLOGY
ISSN journal
0038111X → ACNP
Volume
42
Issue
3
Year of publication
1999
Database
ISI
SICI code
0038-111X(199903)42:3<29:ICOSLF>2.0.ZU;2-#
Abstract
A controlled ambient hot-plate oven can optimally cure HSQ films in 1-3 min , replacing 30-60 min batch furnace cures. The move to an in-line cure allo wed for greater control, reduced handling losses, and proved to be a more r obust overall process. Oxygen in the nitrogen ambient must be <100 ppm to e nsure optimal final film properties.