Choosing a thermal model for electrothermal simulation of power semiconductor devices

The literature proposes some thermal models needed for the electrothermal s imulation of power electronic systems, This paper gives a useful analysis a bout the choice of the thermal model circuit networks, equivalent to a disc retization of the heat equation by the finite difference method (FDM) and t he finite-element method (FEM), and an analytic model developed by applying an internal approximation of the heat diffusion problem, The effect of the boundary condition representation and the introduced errors on temperature response at the heat source are studied. This study is advantageous, parti cularly for large surges of a short time duration.