Wafer-level in-registry microstamping

Citation
A. Folch et Ma. Schmidt, Wafer-level in-registry microstamping, J MICROEL S, 8(1), 1999, pp. 85-89
Citations number
18
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
ISSN journal
10577157 → ACNP
Volume
8
Issue
1
Year of publication
1999
Pages
85 - 89
Database
ISI
SICI code
1057-7157(199903)8:1<85:WIM>2.0.ZU;2-0
Abstract
Microstamping is an inexpensive technique that allows for micrometer-scale patterning of a rich variety of materials by a replication procedure based on an elastomeric stamp, We have investigated the scalability of microstamp ing for its use in the fabrication of microelectromechanical systems. Until now, the application of microstamping to multilayer processing at a wafer level has been impaired by the flexibility of the stamp, By mounting the st amp onto a rigid glass surface, we demonstrate the feasibility of in-regist ry multilayer microstamping at a 4-in wafer level. [287].