A technique for thermal characterization of anisotropic dielectric films is
developed. The technique is applicable to a film which has thickness of th
e order of 1 mu m and is on a substrate with high thermal conductivity. Met
al lines with various widths are deposited on the film using standard IC fa
brication processes and are subjected to harmonic Joule heating. Monitoring
the resulting amplitude of temperature oscillations in the metal lines all
ows the determination of the in-plane and out-of-plane thermal conductivity
. The present work performs thermometry using the electrical method known a
s the 3 omega technique and also the thermoreflectance technique. Measureme
nt results are reported for polyimide films on silicon substrates. (C) 1999
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