Applied rolling and sensitivity of Bi(2223)/Ag tapes on I-c degradation bymechanical stress

Citation
P. Kovac et al., Applied rolling and sensitivity of Bi(2223)/Ag tapes on I-c degradation bymechanical stress, SUPERCOND S, 12(3), 1999, pp. 168-171
Citations number
12
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
SUPERCONDUCTOR SCIENCE & TECHNOLOGY
ISSN journal
09532048 → ACNP
Volume
12
Issue
3
Year of publication
1999
Pages
168 - 171
Database
ISI
SICI code
0953-2048(199903)12:3<168:ARASOB>2.0.ZU;2-I
Abstract
An experimental study of multicorr: Bi(2223)/Ag tapes, roll-sintered by dif ferent methods and subjected to bending and tension stresses has been perfo rmed. The tapes, of various technological histories, were bent and tensione d and subsequently the transport current was measured at each stressed stat e. Comparison of I-c degradation curves shows that applied rolling may infl uence the sensitivity of Bi-2223 filaments against the mechanical stress. T he existence of transverse microcracks caused by intermediate rolling leads to a higher sensitivity of the tape to bending. A lowering of critical cur rent degradation was observed for two-axially rolled tapes having a higher filament density and better homogeneity prior to sintering treatment.